About this Dataset

Data Associated With "Characterizing The Broadband RF Permittivity Of 3D-integrated Layers In A Glass Wafer Stack From 100 MHz To 30 GHz" For The 2024 International Microwave Symposium (IMS) In Washington, D.C.

We present a method for accurately determining the permittivity of dielectric materials in 3D integrated structures at broadband RF frequencies. With applications of microwave and millimeter-wave electronics on the rise, reliable methods for measuring the electrical properties of dielectrics used in integrated circuits are critical. We outline an on-wafer method for extracting the permittivity of a 3D multilayer glass structure from 100 MHz to 30 GHz using S-parameter measurements of different calibration chips. Our method can be used to inform better design of metrology for dielectric materials for 3D integrated circuit technologies.This is data associated with the manuscript "Characterizing the broadband RF permittivity of 3D-integrated layers in a glass wafer stack from 100 MHz to 30 GHz" for the 2024 International Microwave Symposium (IMS) in Washington, D.C. The manuscript is currently under review by ERB in the NPS system under PUB ID 957051 / N2024-0193
Organization: Department of Commerce
Last updated: 2025-09-30T05:27:18.307529
Tags: dielectrics, glass, microwave-integrated-circuits, permittivity, wafer-level-packaging

Tables

Figure 4a Resistance-Inductance-Capacitance Of Chip 1 Substrate Calibration Chip

@usgov.doc_gov_data_associated_with_characterizing_the_broadb_19b6fb59.figure_4a_resistance_inductance_capacitance_of_chip_1__c243d46b

11.32 kB
167 rows
5 columns

CREATE TABLE figure_4a_resistance_inductance_capacitance_of_chip_1__c243d46b (
  "frequency_hz" DOUBLE  -- Frequency (Hz),
  "frequency_ghz" DOUBLE  -- Frequency (GHz),
  "resistance_per_unit_length_kohm_m" DOUBLE  -- Resistance Per Unit Length (kohm/m),
  "inductance_per_unit_length_h_m" DOUBLE  -- Inductance Per Unit Length (µH/m),
  "capacitance_per_unit_length_pf_m" DOUBLE  -- Capacitance Per Unit Length (pF/m)
);

Figure 4b Resistance-Inductance-Capacitance Of Chip 2 Bonding Layer Calibration Chip

@usgov.doc_gov_data_associated_with_characterizing_the_broadb_19b6fb59.figure_4b_resistance_inductance_capacitance_of_chip_2__2ead6e9a

11.32 kB
168 rows
5 columns

CREATE TABLE figure_4b_resistance_inductance_capacitance_of_chip_2__2ead6e9a (
  "frequency_hz" DOUBLE  -- Frequency (Hz),
  "frequency_ghz" DOUBLE  -- Frequency (GHz),
  "resistance_per_unit_length_kohm_m" DOUBLE  -- Resistance Per Unit Length (kohm/m),
  "inductance_per_unit_length_h_m" DOUBLE  -- Inductance Per Unit Length (µH/m),
  "capacitance_per_unit_length_pf_m" DOUBLE  -- Capacitance Per Unit Length (pF/m)
);

Figure 4c Resistance-Inductance-Capacitance Of Chip 3 Superstrate Calibration Chip

@usgov.doc_gov_data_associated_with_characterizing_the_broadb_19b6fb59.figure_4c_resistance_inductance_capacitance_of_chip_3__f1610755

11.32 kB
168 rows
5 columns

CREATE TABLE figure_4c_resistance_inductance_capacitance_of_chip_3__f1610755 (
  "frequency_hz" DOUBLE  -- Frequency (Hz),
  "frequency_ghz" DOUBLE  -- Frequency (GHz),
  "resistance_per_unit_length_kohm_m" DOUBLE  -- Resistance Per Unit Length (kohm/m),
  "inductance_per_unit_length_h_m" DOUBLE  -- Inductance Per Unit Length (µH/m),
  "capacitance_per_unit_length_pf_m" DOUBLE  -- Capacitance Per Unit Length (pF/m)
);

Figure 5a Mapping Functions From Simulations

@usgov.doc_gov_data_associated_with_characterizing_the_broadb_19b6fb59.figure_5a_mapping_functions_from_simulations

4.64 kB
9 rows
5 columns

CREATE TABLE figure_5a_mapping_functions_from_simulations (
  "unnamed_0" VARCHAR  -- Unnamed: 0,
  "capacitance_pf_m" DOUBLE  -- Capacitance (pF/m),
  "permittivity_real_part" BIGINT  -- Permittivity (real Part),
  "slope" VARCHAR,
  "y_intercept" VARCHAR
);

Figure 5b Permittivity Of Glass

@usgov.doc_gov_data_associated_with_characterizing_the_broadb_19b6fb59.figure_5b_permittivity_of_glass

12.13 kB
168 rows
7 columns

CREATE TABLE figure_5b_permittivity_of_glass (
  "unnamed_0" VARCHAR  -- Unnamed: 0,
  "chip_1_substrate_fig_5b" VARCHAR  -- Chip 1 - Substrate (Fig. 5b),
  "unnamed_2" VARCHAR  -- Unnamed: 2,
  "chip_2_bonding_layer_fig_5b" VARCHAR  -- Chip 2 - Bonding Layer (Fig. 5b),
  "unnamed_4" VARCHAR  -- Unnamed: 4,
  "chip_3_superstrate_fig_5b" VARCHAR  -- Chip 3 - Superstrate (Fig. 5b),
  "unnamed_6" VARCHAR  -- Unnamed: 6
);

Table 1 Coplanar Waveguide Dimensions

@usgov.doc_gov_data_associated_with_characterizing_the_broadb_19b6fb59.table_1_coplanar_waveguide_dimensions

7.66 kB
21 rows
9 columns

CREATE TABLE table_1_coplanar_waveguide_dimensions (
  "stylus_profilometry_kla_tencor_p7" VARCHAR  -- Stylus Profilometry (KLA Tencor P7),
  "unnamed_1" VARCHAR  -- Unnamed: 1,
  "unnamed_2" VARCHAR  -- Unnamed: 2,
  "unnamed_3" VARCHAR  -- Unnamed: 3,
  "unnamed_4" VARCHAR  -- Unnamed: 4,
  "unnamed_5" VARCHAR  -- Unnamed: 5,
  "unnamed_6" VARCHAR  -- Unnamed: 6,
  "unnamed_7" VARCHAR  -- Unnamed: 7,
  "unnamed_8" VARCHAR  -- Unnamed: 8
);