Data Associated With "Characterizing The Broadband RF Permittivity Of 3D-integrated Layers In A Glass Wafer Stack From 100 MHz To 30 GHz" For The 2024 International Microwave Symposium (IMS) In Washington, D.C.

Name: Data Associated With "Characterizing The Broadband RF Permittivity Of 3D-integrated Layers In A Glass Wafer Stack From 100 MHz To 30 GHz" For The 2024 International Microwave Symposium (IMS) In Washington, D.C.
Creator: US Government
Published: 2025-10-23T04:04:01.626Z
License: https://www.nist.gov/open/license

US Government

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@usgov.doc_gov_data_associated_with_characterizing_the_broadb_19b6fb59

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