Data Associated With "Characterizing The Broadband RF Permittivity Of 3D-integrated Layers In A Glass Wafer Stack From 100 MHz To 30 GHz" For The 2024 International Microwave Symposium (IMS) In Washington, D.C.

CREATE TABLE figure_5a_mapping_functions_from_simulations (
  "unnamed_0" VARCHAR,
  "capacitance_pf_m" DOUBLE,
  "permittivity_real_part" BIGINT,
  "slope" VARCHAR,
  "y_intercept" VARCHAR
);

CREATE TABLE table_1_coplanar_waveguide_dimensions (
  "stylus_profilometry_kla_tencor_p7" VARCHAR,
  "unnamed_1" VARCHAR,
  "unnamed_2" VARCHAR,
  "unnamed_3" VARCHAR,
  "unnamed_4" VARCHAR,
  "unnamed_5" VARCHAR,
  "unnamed_6" VARCHAR,
  "unnamed_7" VARCHAR,
  "unnamed_8" VARCHAR
);

CREATE TABLE figure_4a_resistance_inductance_capacitance_of_chip_1__c243d46b (
  "frequency_hz" DOUBLE,
  "frequency_ghz" DOUBLE,
  "resistance_per_unit_length_kohm_m" DOUBLE,
  "inductance_per_unit_length_h_m" DOUBLE,
  "capacitance_per_unit_length_pf_m" DOUBLE
);

CREATE TABLE figure_4b_resistance_inductance_capacitance_of_chip_2__2ead6e9a (
  "frequency_hz" DOUBLE,
  "frequency_ghz" DOUBLE,
  "resistance_per_unit_length_kohm_m" DOUBLE,
  "inductance_per_unit_length_h_m" DOUBLE,
  "capacitance_per_unit_length_pf_m" DOUBLE
);

CREATE TABLE figure_4c_resistance_inductance_capacitance_of_chip_3__f1610755 (
  "frequency_hz" DOUBLE,
  "frequency_ghz" DOUBLE,
  "resistance_per_unit_length_kohm_m" DOUBLE,
  "inductance_per_unit_length_h_m" DOUBLE,
  "capacitance_per_unit_length_pf_m" DOUBLE
);

CREATE TABLE figure_5b_permittivity_of_glass (
  "unnamed_0" VARCHAR,
  "chip_1_substrate_fig_5b" VARCHAR,
  "unnamed_2" VARCHAR,
  "chip_2_bonding_layer_fig_5b" VARCHAR,
  "unnamed_4" VARCHAR,
  "chip_3_superstrate_fig_5b" VARCHAR,
  "unnamed_6" VARCHAR
);